Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CMF658K8700FHEK70 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 100 | |
Category | Resistors | |
Family | Through Hole Resistors | |
Series | CMF | |
Packaging | Bulk | |
Resistance (Ohms) | 8.87k | |
Tolerance | ±1% | |
Power (Watts) | 1.5W | |
Composition | Metal Film | |
Features | Flame Retardant Coating, Moisture Resistant, Safety | |
Temperature Coefficient | ±50ppm/°C | |
Operating Temperature | -55°C ~ 175°C | |
Package / Case | Axial | |
Supplier Device Package | Axial | |
Size / Dimension | 0.180" Dia x 0.562" L (4.57mm x 14.27mm) | |
Height | - | |
Number of Terminations | 2 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CMF658K8700FHEK70 | |
Related Links | CMF658K8, CMF658K8700FHEK70 Datasheet, Vishay/Dale Distributor |
![]() | CD74HC670E | IC REGISTER FILE 4X4 HS 16-DIP | datasheet.pdf | |
![]() | HBC28DRTH-S734 | CONN EDGECARD 56POS DIP .100 SLD | datasheet.pdf | |
![]() | RNF-100-3/8-BU-SP | HEAT SHRINK TUBING | datasheet.pdf | |
![]() | PIC32MX230F064DT-V/ML | IC MCU 32BIT 64KB FLASH 44QFN | datasheet.pdf | |
![]() | RNC60H2432FSB14 | RES 24.3K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | ATS-08H-14-C3-R0 | HEATSINK 50X50X20MM XCUT T412 | datasheet.pdf | |
![]() | S-5716ACDL0-I4T1U | IC HALL EFFECT SENSOR SNT-4A | datasheet.pdf | |
![]() | 112537 | CONN BNC PLUG STR 50OHM CRIMP | datasheet.pdf | |
![]() | CIR06F-28-21S-F80-T89-VO | CIR 37C 37#16 SKT PLUG | datasheet.pdf | |
![]() | CRCW080527K4FKTB | RES SMD 27.4K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | 1852050-2 | HDM SMPR146F200O K | datasheet.pdf | |
![]() | SIT9002AC-33H25DD | OSC MEMS PROG | datasheet.pdf |