Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CN0966B22G55S6-200 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CN0966B22G55S6-200 | |
| Related Links | CN0966B22, CN0966B22G55S6-200 Datasheet, Bel Fuse Inc. Distributor | |
![]() | EMC30DREH-S93 | CONN EDGECARD 60POS .100 EYELET | datasheet.pdf | |
![]() | ECM24DCWH | CONN EDGECARD 48POS DIP .156 SLD | datasheet.pdf | |
![]() | 0098.0103 | SEALING KIT | datasheet.pdf | |
![]() | VE-22Y-IV-B1 | CONVERTER MOD DC/DC 3.3V 99W | datasheet.pdf | |
![]() | 0640015575 | LOCATOR ASSEMBLY | datasheet.pdf | |
![]() | RER70F8R06RC02 | RES CHAS MNT 8.06 OHM 1% 20W | datasheet.pdf | |
![]() | B65512C2001X | YOKE P 7 X 4 | datasheet.pdf | |
![]() | RC1005F38R3CS | RES SMD 38.3 OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | EP2AGZ225HF40C3N | IC FPGA 734 I/O 1517FBGA | datasheet.pdf | |
![]() | T18R1STNLM5 | HIGH TEMP TIE 4"L 18LB BROWN | datasheet.pdf | |
![]() | DSC1001BI2-037.0000T | OSC MEMS 37.000MHZ CMOS SMD | datasheet.pdf | |
![]() | SPC5604BK0MLH6R | IC MCU 32BIT 512KB FLASH 64LQFP | datasheet.pdf |