Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CPU .63X.63 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
Standard Package | 100 | |
Category | Fans, Thermal Management | |
Family | Thermal - Pads, Sheets | |
Series | CPU Pad™ | |
Usage | CPU | |
Shape | Square | |
Outline | 16.00mm x 16.00mm | |
Thickness | 0.0050" (0.127mm) | |
Material | - | |
Adhesive | - | |
Backing, Carrier | - | |
Color | Tan | |
Thermal Resistivity | - | |
Thermal Conductivity | 0.6 W/m-K | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CPU .63X.63 | |
Related Links | CPU ., CPU .63X.63 Datasheet, Bergquist Distributor |
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