Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CY62136FV30LL-45ZSXI | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Qualification of Polyimide Process 13/Dec/2013 Qualification Test/Finish Site 15/Dec/2013 Qualification Test Site 13/Mar/2014 Qualification Copper Wire Bonds 18/Jun/2014 | |
| PCN Packaging | Alternative Tray 16/Dec/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 135 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | MoBL® | |
| Packaging | Tube | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Asynchronous | |
| Memory Size | 2M (128K x 16) | |
| Speed | 45ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.2 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 44-TSOP (0.400", 10.16mm Width) | |
| Supplier Device Package | 44-TSOP II | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CY62136FV30LL-45ZSXI | |
| Related Links | CY62136FV3, CY62136FV30LL-45ZSXI Datasheet, Cypress Semiconductor Distributor | |
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