Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CY62167DV30LL-55BVI | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | GSMC Manufacture Merger 15/May/2014 | |
| PCN Other | Multiple Updates 27/Mar/2015 Transition to 65-nanometer 24/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 210 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | MoBL® | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Asynchronous | |
| Memory Size | 16M (2M x 8, 1M x 16) | |
| Speed | 55ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.2 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 48-VFBGA | |
| Supplier Device Package | 48-VFBGA (8x9.5) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CY62167DV30LL-55BVI | |
| Related Links | CY62167DV, CY62167DV30LL-55BVI Datasheet, Cypress Semiconductor Distributor | |
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