Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CY7C1670KV18-450BZXC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | QDR II+ and DDR II+ Xtreme line of devices | |
| PCN Other | Multiple Updates 27/Mar/2015 | |
| Standard Package | 105 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous, DDR II+ | |
| Memory Size | 144M (4M x 36) | |
| Speed | 450MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.9 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 165-LBGA | |
| Supplier Device Package | 165-FBGA (15x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CY7C1670KV18-450BZXC | |
| Related Links | CY7C1670KV, CY7C1670KV18-450BZXC Datasheet, Cypress Semiconductor Distributor | |
![]() | ESM18DRTF | CONN EDGECARD 36POS DIP .156 SLD | datasheet.pdf | |
| XC5VLX30-2FF676I | IC FPGA 400 I/O 676FCBGA | datasheet.pdf | ||
![]() | FLUKE-179/61 KIT | KIT COMBO INFRARED THERMOMETER | datasheet.pdf | |
![]() | SL15 47003 | ICL 47 OHM 20% 3A 15MM | datasheet.pdf | |
![]() | LM3S1J11-IQC50-C1 | IC MCU 32BIT 128KB FLASH 100LQFP | datasheet.pdf | |
![]() | VI-JW3-IX | CONVERTER MOD DC/DC 24V 75W | datasheet.pdf | |
![]() | D38999/20WH53BD | CONN HSG RCPT FLANGE 53POS SKT | datasheet.pdf | |
![]() | SR217C103KAR | CAP CER 10000PF 500V X7R RADIAL | datasheet.pdf | |
![]() | FGG.1B.130.LC | COLLET NUT FOR FGG.1B. | datasheet.pdf | |
![]() | TNM4-9.5-61-1 | ROUND STANDOFF M4 NYLON 61MM | datasheet.pdf | |
![]() | TVS07RK-15-35JN | TV 37C 37#22D SKT J/N RECP | datasheet.pdf | |
![]() | THEVA217-V2 | EVAL BOARD KIT THCV217-2LANE | datasheet.pdf |