Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CY7C2270KV18-550BZXI | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Featured Product | QDR II+ and DDR II+ Xtreme line of devices | |
PCN Assembly/Origin | Qualification of Die Attach Film 13/Dec/2013 Assembly Site Add 08/Oct/2015 | |
PCN Other | Multiple Updates 27/Mar/2015 | |
Standard Package | 136 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | SRAM - Synchronous, DDR II+ | |
Memory Size | 36M (1M x 36) | |
Speed | 550MHz | |
Interface | Parallel | |
Voltage - Supply | 1.7 V ~ 1.9 V | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 165-LBGA | |
Supplier Device Package | 165-FBGA (13x15) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CY7C2270KV18-550BZXI | |
Related Links | CY7C2270KV, CY7C2270KV18-550BZXI Datasheet, Cypress Semiconductor Distributor |
![]() | RC0603JR-0775KL | RES SMD 75K OHM 5% 1/10W 0603 | datasheet.pdf | |
![]() | RG2012P-78R7-W-T1 | RES SMD 78.7 OHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | GSM36DRSN | CONN EDGECARD 72POS DIP .156 SLD | datasheet.pdf | |
![]() | NE57810S/N1,518 | IC DDR TERMINATION SPAK-5 | datasheet.pdf | |
![]() | ASM3P2872AF-06OR | IC CLK GEN EMI REDUCTION 6TSOP | datasheet.pdf | |
![]() | 218M616-19B | CONN BACKSHELL ADPT SZ 16 16S | datasheet.pdf | |
![]() | CA3106E36-10SXB | CONN PLUG 48POS INLINE W/SKTS | datasheet.pdf | |
![]() | 9441570000 | RS32ES-DP/F RSV 1.6V INTERFACE | datasheet.pdf | |
![]() | RCB40DYHT | CONN EDGECARD 40POS .050 THRUHL | datasheet.pdf | |
IPC0048-S | POWERSOIC-24/PSOP-24/HSOP-24 STE | datasheet.pdf | ||
![]() | 5-1393139-7 | RELAY | datasheet.pdf | |
![]() | QC157 | QC157 | datasheet.pdf |