Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CYW15G0403DXB-BGC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Interface - Telecom | |
| Series | HOTlink II™ | |
| Packaging | Tray | |
| Function | * | |
| Interface | * | |
| Number of Circuits | 4 | |
| Voltage - Supply | 3.135 V ~ 3.465 V | |
| Current - Supply | * | |
| Power (Watts) | * | |
| Operating Temperature | * | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-LBGA Exposed Pad | |
| Supplier Device Package | 256-BGA | |
| Includes | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CYW15G0403DXB-BGC | |
| Related Links | CYW15G04, CYW15G0403DXB-BGC Datasheet, Cypress Semiconductor Distributor | |
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