Harwin Inc. D0818-01

D0818-01 picture photo
Mfg. Part Number
D0818-01
Manufacturer
Product Category
Sockets for ICs, Transistors
Brief Description
CONN IC DIP SOCKET 18POS GOLD
Datasheet Download
D0818-01.pdf
Availability of D0818-01

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of D0818-01, we specialize in Harwin Inc. all series electronic components. D0818-01 can be shipped within 24 hours after order. If you have any demands for D0818-01, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
D0818-01 Order Process
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Specifications of D0818-01
Internal Part NumberEIS-D0818-01
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)Obsolete / Discontinued
ConditionNew & Unused, Original Sealed
Standard Package23
Category Connectors, Interconnects
FamilySockets for ICs, Transistors
SeriesD0
PackagingBulk
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)18 (2 x 9)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post196.8µin (5.00µm)
Contact Material - PostBrass
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Temperature-55°C ~ 125°C
Termination Post Length0.510" (12.95mm)
Material Flammability RatingUL94 V-0
Current Rating1A
Contact Resistance10 mOhm
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)D0818-01
Related LinksD081, D0818-01 Datasheet, Harwin Inc. Distributor
D0818-01 Details Description
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