Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-D0818-01 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
Standard Package | 23 | |
Category | Connectors, Interconnects | |
Family | Sockets for ICs, Transistors | |
Series | D0 | |
Packaging | Bulk | |
Type | DIP, 0.3" (7.62mm) Row Spacing | |
Number of Positions or Pins (Grid) | 18 (2 x 9) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 10µin (0.25µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Open Frame | |
Termination | Wire Wrap | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Tin | |
Contact Finish Thickness - Post | 196.8µin (5.00µm) | |
Contact Material - Post | Brass | |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |
Operating Temperature | -55°C ~ 125°C | |
Termination Post Length | 0.510" (12.95mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 1A | |
Contact Resistance | 10 mOhm | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | D0818-01 | |
Related Links | D081, D0818-01 Datasheet, Harwin Inc. Distributor |
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