Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/20FG35JC-LC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/20FG35JC-LC | |
| Related Links | D38999/20, D38999/20FG35JC-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | ADM241LARZ-REEL | IC TXRX RS-232 4:5 5V LP 28SSOP | datasheet.pdf | |
![]() | EBC22DREH-S734 | CONN EDGECARD 44POS .100 EYELET | datasheet.pdf | |
![]() | 1812SA221JAT9A | CAP CER 220PF 1.5KV NP0 1812 | datasheet.pdf | |
![]() | 06031A7R5CAT4A | CAP CER 7.5PF 100V NP0 0603 | datasheet.pdf | |
![]() | TNPW080520R0BEEA | RES SMD 20 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | ADC12C170HFEB/NOPB | BOARD EVAL ADC12C170HF >150MHZ | datasheet.pdf | |
![]() | 45MIC 3M663X TP SHEET 6X6 | DIAMOND LAPPING FILM 663X | datasheet.pdf | |
![]() | RWR89S1R21FMBSL | RES 1.21 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | CMF70215K00FHEK | RES 215K OHM 1.75W 1% AXIAL | datasheet.pdf | |
![]() | SSR-80-W35M-R91-KB603 | BIG CHIP LED HB MODULE WHITE | datasheet.pdf | |
![]() | XC7VX690T-2FF1158I | IC FPGA 350 I/O 1158FCBGA | datasheet.pdf | |
![]() | ATS-05C-112-C3-R1 | HEATSINK 60X40X12.7MM XCUT T412 | datasheet.pdf |