Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/20ME26BC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/20ME26BC | |
| Related Links | D38999/, D38999/20ME26BC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | 2SJ067400L | MOSFET P-CH 30V 100MA SSSMINI-3 | datasheet.pdf | |
![]() | HM2P08PKM2P5GF | CONN HEADER 125POS TYPE B VERT | datasheet.pdf | |
![]() | SFN08A4702CBQLF7 | RES ARRAY 4 RES 47K OHM 8DFN | datasheet.pdf | |
![]() | 0015915329 | CGRID SMT BKWY HDR 30 SAU 32CKT | datasheet.pdf | |
![]() | AFD58-12-10SN-6139 | CONN HSG RCPT FLANGE 10POS SKT | datasheet.pdf | |
![]() | CMF60100K00BEEB70 | RES 100K OHM 1W .1% AXIAL | datasheet.pdf | |
![]() | AT91SAM9CN12-CU | IC MCU ARM9 128KB ROM 217BGA | datasheet.pdf | |
![]() | ATS-03G-150-C3-R0 | HEATSINK 35X35X25MM L-TAB T412 | datasheet.pdf | |
![]() | 67F050-0316 | THERMOSTAT 50 DEG NO TO-220 | datasheet.pdf | |
![]() | 1618774 | ST-5ES1N8ACK04S | datasheet.pdf | |
![]() | ME30A2403F01 | CLASS I DESKTOP 24V 30W | datasheet.pdf | |
![]() | GTC030RV28-21P-025 | GT 37C 37#16 PIN RECP WALL | datasheet.pdf |