Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/20MH21HN-LC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/20MH21HN-LC | |
| Related Links | D38999/20, D38999/20MH21HN-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | ECS-122.8-S-7S-TR | Crystal 12.2880MHz 30ppm Series 60 Ohm -10°C - 70°C Surface Mount 4-SOJ, 9.40mm pitch | datasheet.pdf | |
![]() | 356-036-520-101 | CARDEDGE 36POS .156 BLACK | datasheet.pdf | |
![]() | INA2322EA/2K5G4 | IC OPAMP INSTR 500KHZ 14TSSOP | datasheet.pdf | |
![]() | AVS227M35F24T-F | CAP ALUM 220UF 20% 35V SMD | datasheet.pdf | |
![]() | MCZ33905S5EK | IC SYSTEM BASIS CHIP GEN2 32SOIC | datasheet.pdf | |
![]() | CB3LV-5I-40M9600 | OSC XO 40.96MHZ HCMOS TTL SMD | datasheet.pdf | |
![]() | ATS-09G-133-C3-R0 | HEATSINK 70X70X10MM XCUT T412 | datasheet.pdf | |
![]() | ATS-10A-172-C2-R0 | HEATSINK 30X30X25MM R-TAB T766 | datasheet.pdf | |
![]() | MBB02070C9202FC100 | RES 92K OHM 0.6W 1% AXIAL | datasheet.pdf | |
![]() | 0636000911 | CAM FOLLOWER | datasheet.pdf | |
![]() | BACC63BV24B30P6H | 26500 30C 30#16 P RECP SS LC | datasheet.pdf | |
![]() | XC4010E-1PG191M | IC FPGA 160 I/O 208QFP | datasheet.pdf |