Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-D38999/20MH55PB | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | D38999/20MH55PB | |
Related Links | D38999/, D38999/20MH55PB Datasheet, Amphenol Aerospace Operations Distributor |
![]() | 2-641600-4 | CONN IC DIP SOCKET 16POS GOLD | datasheet.pdf | |
![]() | AP1084K50L-U | IC REG LDO 5V 5A TO263-3 | datasheet.pdf | |
![]() | ACC13DRYS | CONN EDGECARD 26POS .100 DIP SLD | datasheet.pdf | |
![]() | L4949ED | IC REG LDO 5V 0.1A 8SO | datasheet.pdf | |
![]() | RNC55H1992BSB14 | RES 19.9K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | F2213/64 BK147 | HEAT SHRINK TUBE 3/64 BK 1000X1" | datasheet.pdf | |
![]() | 83274605 | SWITCH SNAP ACTION 5A SPST | datasheet.pdf | |
![]() | 4215PA51G01800 | RECTANGLE | datasheet.pdf | |
![]() | ATS-18H-185-C3-R0 | HEATSINK 40X40X30MM R-TAB T412 | datasheet.pdf | |
![]() | SIT1602AIR3-28E | OSC MEMS PROG 5.0X3.2MM 2.8V | datasheet.pdf | |
![]() | 5-830611-1 | LGH 1/2 ELECT MLD END LEAD | datasheet.pdf | |
![]() | XC5VLX155-3FF1153I | IC FPGA 800 I/O 1153FCBGA | datasheet.pdf |