Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/20TE2PA-LC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/20TE2PA-LC | |
| Related Links | D38999/2, D38999/20TE2PA-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | CTX25-3P-R | INDUCT ARRAY 2 COIL 25.33UH SMD | datasheet.pdf | |
![]() | CF14JA10M0 | RES 10M OHM 1/4W 5% CARBON FILM | datasheet.pdf | |
![]() | 430212-05-0 | Connector Barrier Block Strip 5 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | VE-J6Y-MW-S | CONVERTER MOD DC/DC 3.3V 66W | datasheet.pdf | |
![]() | 0430452020 | MICROFIT 3.0 V HDR /NAIL DR 30AU | datasheet.pdf | |
![]() | RN65D4120FB14 | RES 412 OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | Y112120R8000B0R | RES SMD 20.8OHM 0.1% 1/4W J LEAD | datasheet.pdf | |
![]() | DMN63D8LDW-13 | MOSFET 2N-CH 30V 0.22A SOT363 | datasheet.pdf | |
![]() | ATS-02A-61-C2-R0 | HEATSINK 40X40X10MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-13C-106-C2-R1 | HEATSINK 45X40X12.7MM XCUT T766 | datasheet.pdf | |
![]() | T38025-04-0 | Connector Barrier Block Strip 4 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | GRM022R60J472KE19L | Capacitors Inductors Filters... | datasheet.pdf |