Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-D38999/20TG16PN-LC | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors - Housings | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | D38999/20TG16PN-LC | |
Related Links | D38999/20, D38999/20TG16PN-LC Datasheet, Amphenol Aerospace Operations Distributor |
![]() | SN74ALS996DWR | IC D READ-BACK LATCH 24-SOIC | datasheet.pdf | |
![]() | ISL6614CRZ-T | IC DRIVER DUAL SYNC BUCK 16-QFN | datasheet.pdf | |
MAX6699UE34+T | SENSOR TEMPERATURE SMBUS 16TSSOP | datasheet.pdf | ||
![]() | SN10KHT5574NT | IC OCTAL ECL-TTL XLATR 24-DIP | datasheet.pdf | |
![]() | 55A0111-22-5 | HOOK-UP STRND 22AWG GREEN | datasheet.pdf | |
![]() | VE-BWW-MV-S | CONVERTER MOD DC/DC 5.5V 150W | datasheet.pdf | |
![]() | VE-BNY-IX-F4 | CONVERTER MOD DC/DC 3.3V 49.5W | datasheet.pdf | |
![]() | XC6VLX760-2FF1760E | IC FPGA 1200 I/O 1760FBGA | datasheet.pdf | |
![]() | ATS-20G-171-C3-R0 | HEATSINK 30X30X20MM R-TAB T412 | datasheet.pdf | |
![]() | ATS-09E-127-C1-R0 | HEATSINK 54X54X20MM XCUT | datasheet.pdf | |
![]() | MKP385375016JBA2B0 | CAP FILM 0.075UF 5% 160VDC AXIAL | datasheet.pdf | |
![]() | GTC00G28-5P | GT 5C 2#4 1#12 2#16 PIN RECP W | datasheet.pdf |