Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/20ZG11SN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/20ZG11SN | |
| Related Links | D38999/, D38999/20ZG11SN Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | GBC06DRXI-S734 | CONN EDGECARD 12POS DIP .100 SLD | datasheet.pdf | |
![]() | TNPW120633K0BEEA | RES SMD 33K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | B14B-PUDSS-1(LF)(SN) | CONN HDR TOP 14 POS W/BOSS 2MM | datasheet.pdf | |
![]() | 0190320062 | KRIMPING DIE (MMT-AA-575-E2) | datasheet.pdf | |
![]() | RN60C2523BBSL | RES 252K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | RL07S362GB14 | RES 3.6K OHM 1/4W 2% AXIAL | datasheet.pdf | |
![]() | ATS-03B-74-C2-R0 | HEATSINK 25X25X15MM R-TAB T766 | datasheet.pdf | |
![]() | KPSE08F18-32PX | KPSE08F18-32PX | datasheet.pdf | |
![]() | 66F050-0305 | THERMOSTAT 50 DEG NO 8-DIP | datasheet.pdf | |
![]() | HMC709LC5TR | IC UPCONVERTER IQ 32SMD | datasheet.pdf | |
![]() | F6N1.50BKBB | F6 SELF WRAP 1-1/2" BLACK 250' | datasheet.pdf | |
![]() | AIT0E10SL-3PS | ER 3C 3#16S PIN RECP | datasheet.pdf |