Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/24MB5SB-LC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/24MB5SB-LC | |
| Related Links | D38999/2, D38999/24MB5SB-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | 0314001.HXP | FUSE CERM 1A 250VAC 125VDC 3AB | datasheet.pdf | |
![]() | HSMS-282L-TR1G | DIODE SCHOTTKY RF TRP 15V SOT363 | datasheet.pdf | |
![]() | 3345P-1-203T | TRIMMER 20K OHM 1W PC PIN | datasheet.pdf | |
![]() | BLM15AG601SH1D | FERRITE CHIP 600 OHM 300MA 0402 | datasheet.pdf | |
![]() | 3010-30-001-11-00 | IDC HEADER .100" 30POS | datasheet.pdf | |
![]() | 315000200516 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | 5CGXFC4C7M13C8N | IC FPGA 175 I/O 383MBGA | datasheet.pdf | |
![]() | 8N4SV76EC-0123CDI | IC OSC VCXO 669.326582MHZ 6-CLCC | datasheet.pdf | |
![]() | 0387312303 | Connector Barrier Block Strip 3 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | ATS-02G-188-C3-R0 | HEATSINK 45X45X15MM R-TAB T412 | datasheet.pdf | |
![]() | VJ0603D150KLBAJ | CAP CER 15PF 100V NP0 0603 | datasheet.pdf | |
![]() | XC2S50-5CSG144I | Spartan-II FPGA Family IC | datasheet.pdf |