Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/26ZE8SB-LC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/26ZE8SB-LC | |
| Related Links | D38999/2, D38999/26ZE8SB-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | 444-074-500-D | ASSEMBLY 4 POSITION 4 CONTACT | datasheet.pdf | |
![]() | MCR18EZHF4531 | RES SMD 4.53K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | 742C163104JP | RES ARRAY 8 RES 100K OHM 2506 | datasheet.pdf | |
![]() | 5250236-63 | EXTRUSION FRONT NON-EMC 12.72" | datasheet.pdf | |
![]() | LD431050 | SCR MOD ISO DUAL 1000V 500A | datasheet.pdf | |
![]() | RCL06121K60JNEA | RES SMD 1.6K OHM 1/2W 1206 WIDE | datasheet.pdf | |
![]() | A3P1000-FG256T | IC FPGA 177 I/O 256FBGA | datasheet.pdf | |
![]() | Y145334R0000B9L | RES 34 OHM 0.6W 0.1% RADIAL | datasheet.pdf | |
![]() | ATS-01D-35-C3-R0 | HEATSINK 36.83X57.6X5.84MM T412 | datasheet.pdf | |
![]() | BXRC-27H1000-B-02 | LED ARRAY 1000LM WARM WHITE | datasheet.pdf | |
![]() | 598204-8 | HDI PIN ASSY 3 ROW 165 POS NO LU | datasheet.pdf | |
![]() | SIT9002AC-38H18DG | OSC MEMS PROG | datasheet.pdf |