Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DF23C-30DP-0.5V(92) | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Board to Board and Board to FPC Connectors | |
| Standard Package | 2,000 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | DF23 | |
| Packaging | Tape & Reel (TR) | |
| Connector Type | Plug, Outer Shroud Contacts | |
| Number of Positions | 30 | |
| Pitch | 0.020" (0.50mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | - | |
| Contact Finish | Gold | |
| Contact Finish Thickness | - | |
| Mated Stacking Heights | 1.5mm | |
| Height Above Board | 0.047" (1.20mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DF23C-30DP-0.5V(92) | |
| Related Links | DF23C-30D, DF23C-30DP-0.5V(92) Datasheet, Hirose Electric Co Ltd Distributor | |
![]() | PMBTA56,215 | TRANS PNP 80V 0.5A SOT23 | datasheet.pdf | |
![]() | GEM24DRXN | CONN EDGECARD 48POS DIP .156 SLD | datasheet.pdf | |
![]() | MPC5553EVB | KIT EVAL MPC5553MZP132 | datasheet.pdf | |
![]() | LNBP10LPUR | IC LNB SUPPLY & CTRL VREG 8-DFN | datasheet.pdf | |
![]() | DCM8W8PK47 | DSUB 8W8 M | datasheet.pdf | |
![]() | VE-BND-MX-B1 | CONVERTER MOD DC/DC 85V 75W | datasheet.pdf | |
![]() | CBT-140-WTH-C15-QA721 | BIG CHIP LED HB MOD WHT 2260LM | datasheet.pdf | |
![]() | TCBN-T2-M4-8-27 | BRD SPT SNAP LCK SCW MNT 1 1/16" | datasheet.pdf | |
![]() | 83547303 | PSH-BTN SW-2PDT-GOLD CONTACTS | datasheet.pdf | |
![]() | ATS-19D-138-C2-R0 | HEATSINK 25X25X15MM L-TAB T766 | datasheet.pdf | |
![]() | BR24G02F-3GTE2 | IC EEPROM I2C BUS 2KBIT 8SOP | datasheet.pdf | |
![]() | KAX-15 | FUSE BUSS SEMI CONDUCTOR | datasheet.pdf |