Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DK-LM3S817 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | Stellaris® | |
| Board Type | Evaluation Platform | |
| Type | MCU 32-Bit | |
| Core Processor | ARM® Cortex®-M3 | |
| Operating System | RTOS | |
| Platform | - | |
| For Use With/Related Products | LM3S317, LM3S617, LM3S817 | |
| Mounting Type | Fixed | |
| Contents | Board(s), Cable(s), LCD, Accessories | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DK-LM3S817 | |
| Related Links | DK-LM, DK-LM3S817 Datasheet, Texas Instruments Distributor | |
![]() | 30CPF06 | DIODE GEN PURP 600V 30A TO247AC | datasheet.pdf | |
![]() | EEE-FP0J152AP | CAP ALUM 1500UF 20% 6.3V SMD | datasheet.pdf | |
![]() | B32559C334K289 | CAP FILM 0.33UF 10% 63VDC RADIAL | datasheet.pdf | |
![]() | RCC25DRYN-S93 | CONN EDGECARD 50POS DIP .100 SLD | datasheet.pdf | |
![]() | 2854623 | HOUSING UPPER FOR PCB TERM BLOCK | datasheet.pdf | |
![]() | B43888A1226M | CAP ALUM 22UF 20% 160V RADIAL | datasheet.pdf | |
![]() | PIC24EP256MC204-H/ML | IC MCU 16BIT 256KB FLASH 44QFN | datasheet.pdf | |
![]() | RBC20DETS | CONN EDGECARD .100" 20POS THRUHL | datasheet.pdf | |
![]() | PLT3H-L86 | CABLE TIE LIGHT-HEAVY 11.1" | datasheet.pdf | |
![]() | 0638110004 | CARRIER GUIDE | datasheet.pdf | |
![]() | MBB0207CC5628FC100 | RES 5.62 OHM 0.6W 1% AXIAL | datasheet.pdf | |
![]() | AD7417 | 10-Bit Digital Temperature Sensor (AD7416) and Single/Four-Channel ADC (AD7417/AD7418) IC | datasheet.pdf |