Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DSP56301PW80 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 36 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - DSP (Digital Signal Processors) | |
| Series | DSP563xx | |
| Packaging | Tray | |
| Type | Fixed Point | |
| Interface | Host Interface, SSI, SCI | |
| Clock Rate | 80MHz | |
| Non-Volatile Memory | ROM (9 kB) | |
| On-Chip RAM | 24kB | |
| Voltage - I/O | 3.30V | |
| Voltage - Core | 3.30V | |
| Operating Temperature | -40°C ~ 100°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 208-LQFP | |
| Supplier Device Package | 208-LQFP (28x28) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSP56301PW80 | |
| Related Links | DSP563, DSP56301PW80 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | 9C08052A9090FKHFT | RES SMD 909 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | 66900-034 | 66900-34-QKE II FEMALE | datasheet.pdf | |
![]() | B32563J1226K | CAP FILM 22UF 10% 100VDC 2DIP | datasheet.pdf | |
![]() | 2455RMG86210124 | PHENOLIC MANUAL RESET THERMOSTAT | datasheet.pdf | |
![]() | SST-50-W45S-F21-GG401 | BIG CHIP LED HB MODULE WHITE | datasheet.pdf | |
![]() | SI8710BD-B-ISR | DGTL ISO 5KV 1CH GEN PURP 6DIPGW | datasheet.pdf | |
![]() | SIT8008AIU1-18S | OSC MEMS PROG 2.5X2.0MM 1.8V | datasheet.pdf | |
![]() | XC7A15T-L1CSG325I | IC FPGA ARTIX7 250 I/O 325CSBGA | datasheet.pdf | |
![]() | 97-3106A20-27SW | 97-3106A20-27SW | datasheet.pdf | |
![]() | 97-3106A36-15PY-940 | AB 35C 35#16 PIN PLUG | datasheet.pdf | |
![]() | GTCL08F20-29P-B20-LC | GT 17C 17#16 PIN PLUG RTANG | datasheet.pdf |