Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DSP56F807VF80 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Obsolescence/ EOL | Multiple Devices 13/Nov/2012 | |
| PCN Design/Specification | Copper Wire Conversion 20/May/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 630 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | 56F8xx | |
| Packaging | Tray | |
| Core Processor | 56800 | |
| Core Size | 16-Bit | |
| Speed | 80MHz | |
| Connectivity | CAN, EBI/EMI, SCI, SPI | |
| Peripherals | POR, PWM, WDT | |
| Number of I/O | 32 | |
| Program Memory Size | 120KB (60K x 16) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 16 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 16x12b | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 160-BGA | |
| Supplier Device Package | 160-MAPBGA (15x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSP56F807VF80 | |
| Related Links | DSP56F, DSP56F807VF80 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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