Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DSPIC30F5013-20I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Asynchronous Stimulus Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Palladium Coated Copper Bond Wire 21/Oct/2013 | |
| PCN Assembly/Origin | Qualification Lead-Frame Paddle 20/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 119 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 30F | |
| Packaging | Tray | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 20 MIPS | |
| Connectivity | CAN, I²C, SPI, UART/USART | |
| Peripherals | AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT | |
| Number of I/O | 68 | |
| Program Memory Size | 66KB (22K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 1K x 8 | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.5 V ~ 5.5 V | |
| Data Converters | A/D 16x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 80-TQFP | |
| Supplier Device Package | 80-TQFP (12x12) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC30F5013-20I/PT | |
| Related Links | DSPIC30F5, DSPIC30F5013-20I/PT Datasheet, Microchip Technology Distributor | |
![]() | PDU-C105Q | PHOTODIODE UV 4.48MM SQ TO-5 | datasheet.pdf | |
![]() | RG1005P-9092-C-T10 | RES SMD 90.9K OHM 1/16W 0402 | datasheet.pdf | |
![]() | RCA15DTKH-S288 | CONN EDGECARD 30POS .125 EXTEND | datasheet.pdf | |
![]() | VE-2VL-IX-F4 | CONVERTER MOD DC/DC 28V 75W | datasheet.pdf | |
![]() | VI-20H-EY-S | CONVERTER MOD DC/DC 52V 50W | datasheet.pdf | |
![]() | RNC55J8161DSRSL | RES 8.16K OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | D25S13A6RX09LF | D-Sub Connector Receptacle, Female Sockets 25 Position Through Hole, Right Angle Solder Paste | datasheet.pdf | |
![]() | ATS-05F-199-C1-R0 | HEATSINK 50X50X6MM XCUT | datasheet.pdf | |
![]() | ATS-19H-172-C3-R0 | HEATSINK 30X30X25MM R-TAB T412 | datasheet.pdf | |
![]() | L77DFAH15S1AMNRM6 | D-Sub Connector Receptacle, Female Sockets 15 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | BFC247042183 | CAP FILM 18NF 5% 250VDC RAD | datasheet.pdf | |
![]() | MAL210158154E3 | 150000UF 63V 76X146MM 85C 15000H | datasheet.pdf |