Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DSPIC33EP128GP506-E/MR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | 70 MIPS dsPIC33EP and PIC24EP Family Overview | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Multiple Devices Datasheet Revision 20/Aug/2013 Multiple Devices Errata Revision 20/Aug/2013 Errata Document Revision 27/Sep/2013 Errata Update 06/Feb/2014 Errata/Datasheet Update 10/Apr/2014 Errata/Datasheet Update 07/Aug/2014 Mold Compound Update 31/Oct/2014 Errata/Datasheet Update 23/Dec/2014 | |
| PCN Assembly/Origin | Assembly Site Addition 22/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33EP | |
| Packaging | Tube | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 60 MIPs | |
| Connectivity | CAN, I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | |
| Number of I/O | 53 | |
| Program Memory Size | 128KB (43K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 16 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 16x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 64-VFQFN Exposed Pad | |
| Supplier Device Package | 64-QFN Exposed Pad (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33EP128GP506-E/MR | |
| Related Links | DSPIC33EP12, DSPIC33EP128GP506-E/MR Datasheet, Microchip Technology Distributor | |
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