Microchip Technology DSPIC33FJ32GP302T-I/MM
- Mfg. Part Number
- DSPIC33FJ32GP302T-I/MM
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 32KB FLASH 28QFNS
- Datasheet Download
- DSPIC33FJ32GP302T-I/MM.pdf
Availability of DSPIC33FJ32GP302T-I/MM
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 3.29001
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33FJ32GP302T-I/MM, we specialize in Microchip Technology all series electronic components. DSPIC33FJ32GP302T-I/MM can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ32GP302T-I/MM, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33FJ32GP302T-I/MM Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33FJ32GP302T-I/MM
| Internal Part Number | EIS-DSPIC33FJ32GP302T-I/MM | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Design/Specification | Multiple Devices 21/May/2013 Multiple Devices Errata Revision 06/Aug/2013 | |
| PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Qualification Assembly Site 01/May/2014 Qualification Report 01/Jul/2014 Qualification Revision 09/Jul/2014 | |
| PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1,600 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, DCI, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 21 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 10x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-VQFN Exposed Pad | |
| Supplier Device Package | 28-QFN-S (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ32GP302T-I/MM | |
| Related Links | DSPIC33FJ32, DSPIC33FJ32GP302T-I/MM Datasheet, Microchip Technology Distributor | |
DSPIC33FJ32GP302T-I/MM Details Description
Related parts for DSPIC33FJ32GP302T-I/MM
 | MCA12060D1822BP500 | RES SMD 18.2K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
 | 4606X-104-221/331L | RES NETWORK 8 RES MULT OHM 6SIP | datasheet.pdf | |
 | GEM10DTAH | CONN EDGECARD 20POS R/A .156 SLD | datasheet.pdf | |
| PBC-009A2E7 | RELAY CONTACTOR 3PST 8A 48V | datasheet.pdf | |
 | FN2020-30-08 | FILTER 1-PHASE GENERAL EMI 30A | datasheet.pdf | |
| C917U180JZNDAAWL40 | CAP CER 18PF 440VAC NP0 RADIAL | datasheet.pdf | |
| M80-6172622 | 26 WAY MALE CONN 2 ROW LATCHED | datasheet.pdf | |
| 09300240290 | CONN BASE SIDE ENTRY SZ24B PG21 | datasheet.pdf | |
 | SIT3808AI-D-18EE | OSC MEMS PROG 1.8V SMD | datasheet.pdf | |
| 3-601966-1 | POSITIONER DANIELS # K776 | datasheet.pdf | |
| CTVS07RF-21-75SB | CTV 4C 4#8(COAX) SKT J/N RECP | datasheet.pdf | |
| 97-3108A24-28PX-940 | AB 24C 24#16 PIN PLUG | datasheet.pdf |