Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DSPIC33FJ32GS406T-50I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Interleaved Power Factor Correction Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs dsPIC® "GS" DSCs | |
| PCN Design/Specification | TQFP-64L Palladium Copper Wire 11/Oct/2013 DSPIC33FJyyGS Datasheet Update 17/Jul/2014 Errata Update 22/Oct/2014 Errata/Datasheet Update 28/Jan/2015 | |
| PCN Assembly/Origin | Qualification Lead-Frame 03/Jun/2014 Revision with Qualification Report 22/Aug/2014 | |
| PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 1,200 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 50 MIPs | |
| Connectivity | I²C, IrDA, LIN, SCI, SPI, UART/USART, USB | |
| Peripherals | Brown-out Detect/Reset, QEI, POR, PWM, WDT | |
| Number of I/O | 58 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 16x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-TQFP | |
| Supplier Device Package | 64-TQFP (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ32GS406T-50I/PT | |
| Related Links | DSPIC33FJ32G, DSPIC33FJ32GS406T-50I/PT Datasheet, Microchip Technology Distributor | |
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