Microchip Technology DSPIC33FJ64GP708-I/PT
- Mfg. Part Number
- DSPIC33FJ64GP708-I/PT
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 64KB FLASH 80TQFP
- Datasheet Download
- DSPIC33FJ64GP708-I/PT.pdf
Availability of DSPIC33FJ64GP708-I/PT
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 5.07000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33FJ64GP708-I/PT, we specialize in Microchip Technology all series electronic components. DSPIC33FJ64GP708-I/PT can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ64GP708-I/PT, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33FJ64GP708-I/PT Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33FJ64GP708-I/PT
| Internal Part Number | EIS-DSPIC33FJ64GP708-I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Introduction to dsPIC33F Architecture Part 1 Asynchronous Stimulus Introduction to dsPIC33F Architecture Part 2 Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Design/Specification | Palladium Coated Copper Bond Wire 21/Oct/2013 | |
| PCN Assembly/Origin | Qualification Lead-Frame Paddle 20/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 119 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tray | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | CAN, I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 69 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 16K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 24x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 80-TQFP | |
| Supplier Device Package | 80-TQFP (12x12) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ64GP708-I/PT | |
| Related Links | DSPIC33FJ6, DSPIC33FJ64GP708-I/PT Datasheet, Microchip Technology Distributor | |
DSPIC33FJ64GP708-I/PT Details Description
Related parts for DSPIC33FJ64GP708-I/PT
 | GEC26DREH-S13 | CONN EDGECARD 52POS .100 EXTEND | datasheet.pdf | |
| ST12L3MZQ | SWITCH TOGGLE SPDT 6A 125V | datasheet.pdf | |
 | ISO7220BD | DGTL ISO 2.5KV GEN PURP 8SOIC | datasheet.pdf | |
 | EKS-LM3S9B92 | KIT EVAL LM3S9B92 CODE COMPOSER | datasheet.pdf | |
 | V24A5M300BG3 | CONVERTER MOD DC/DC 5V 300W | datasheet.pdf | |
 | RNC55J7063DSB14 | RES 706K OHM 1/8W .5% AXIAL | datasheet.pdf | |
| RN60C7501BB14 | RES 7.5K OHM 1/4W .1% AXIAL | datasheet.pdf | |
| IELBX0-33109-50-V | CIRCUIT BREAKER MAG-HYDR ROCKER | datasheet.pdf | |
| TC-10 | CASE KIT TESTERS-V C | datasheet.pdf | |
 | 800-80-017-10-002101 | CONN HDR 17POS 0.100 T/H | datasheet.pdf | |
 | 17405 | SOLDERING STATION WITH LCD DISPL | datasheet.pdf | |
| GTS00F14S-2SY | GT 4C 4#16S SKT RECP WALL | datasheet.pdf |