Microchip Technology DSPIC33FJ64GS608-I/PT
- Mfg. Part Number
- DSPIC33FJ64GS608-I/PT
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 64KB FLASH 80TQFP
- Datasheet Download
- DSPIC33FJ64GS608-I/PT.pdf
Availability of DSPIC33FJ64GS608-I/PT
Available Quantity
6206 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 4.96000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33FJ64GS608-I/PT, we specialize in Microchip Technology all series electronic components. DSPIC33FJ64GS608-I/PT can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ64GS608-I/PT, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33FJ64GS608-I/PT Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33FJ64GS608-I/PT
| Internal Part Number | EIS-DSPIC33FJ64GS608-I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Interleaved Power Factor Correction Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | SMPS & Digital Power Conversion Solutions PIC24FJ/33FJ MCUs & dsPIC® DSCs dsPIC® "GS" DSCs | |
| PCN Design/Specification | Palladium Coated Copper Bond Wire 21/Oct/2013 DSPIC33FJyyGS Datasheet Update 17/Jul/2014 Errata Update 22/Oct/2014 Errata/Datasheet Update 28/Jan/2015 | |
| PCN Assembly/Origin | Qualification Lead-Frame Paddle 20/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 119 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tray | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | CAN, I²C, IrDA, LIN, SPI, UART/USART, USB | |
| Peripherals | Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT | |
| Number of I/O | 74 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 9K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 18x10b, D/A 1x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 80-TQFP | |
| Supplier Device Package | 80-TQFP (12x12) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ64GS608-I/PT | |
| Related Links | DSPIC33FJ6, DSPIC33FJ64GS608-I/PT Datasheet, Microchip Technology Distributor | |
DSPIC33FJ64GS608-I/PT Details Description
Related parts for DSPIC33FJ64GS608-I/PT
 | 12065A1R8CAT2A | CAP CER 1.8PF 50V NP0 1206 | datasheet.pdf | |
 | RBM08DTBN-S664 | CONN EDGECARD 16POS R/A .156 SLD | datasheet.pdf | |
| MA501A103JAATR1 | CAP CER 10000PF 100V NP0 AXIAL | datasheet.pdf | |
 | 1777781 | TERM BLOCK PLUG 8POS STR 7.62MM | datasheet.pdf | |
| 939-925 | ROUND SPACER 0.047" NYLON 23.5MM | datasheet.pdf | |
| RN60C3702BB14 | RES 37K OHM 1/4W .1% AXIAL | datasheet.pdf | |
| 998144 | FPA/C 697 MDL740 1.0M | datasheet.pdf | |
| A-TB500-TJ23 | TERMINAL BLOCK | datasheet.pdf | |
| SMH152-LPSE-D31-SP-BK | CONN HEADER 1MM 60POS | datasheet.pdf | |
| GS-ADK-OTAFU2000 | KIT ADK OTAFU NO HW | datasheet.pdf | |
 | ATS-X53325B-C1-R0 | SUPERGRIP HEATSINK 32X32X7.5MM | datasheet.pdf | |
 | XTEAWT-02-0000-00000LDC3 | LED XLAMP XT-E 4300K WHITE SMD | datasheet.pdf |