Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EFM32LG332F64-QFP64T | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Other | PCN-1406131 13/Jun/2014 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Leopard Gecko | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M3 | |
| Core Size | 32-Bit | |
| Speed | 48MHz | |
| Connectivity | I²C, IrDA, SmartCard, SPI, UART/USART, USB | |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | |
| Number of I/O | 50 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 32K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.85 V ~ 3.8 V | |
| Data Converters | A/D 8x12b, D/A 2x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-TQFP | |
| Supplier Device Package | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EFM32LG332F64-QFP64T | |
| Related Links | EFM32LG332, EFM32LG332F64-QFP64T Datasheet, Silicon Labs Distributor | |
![]() | 60HFUR-400 | DIODE GEN PURP 400V 60A DO203AB | datasheet.pdf | |
![]() | VSMG2700-GS08 | EMITTER IR 830NM 100MA SMD | datasheet.pdf | |
![]() | RNC50J1213BSBSL | RES 121K OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | 10YXG1500MEFCT810X20 | CAP ALUM 1500UF 20% 10V RADIAL | datasheet.pdf | |
![]() | EKMQ401VSN331MA30S | CAP ALUM 330UF 20% 400V SNAP | datasheet.pdf | |
![]() | 32591-1960 | UM MAT JOINING TRIM COVER 96" | datasheet.pdf | |
![]() | MIL4922-42L | FIXED IND 2.7MH 131MA 23 OHM SMD | datasheet.pdf | |
![]() | TAGPP3T4-822 | WHITE POLYESTER .688" X .25" | datasheet.pdf | |
![]() | ATS-10F-31-C3-R0 | HEATSINK 57.9X36.83X5.84MM T412 | datasheet.pdf | |
![]() | ATS-04G-11-C3-R0 | HEATSINK 50X50X10MM XCUT T412 | datasheet.pdf | |
![]() | RCP1206W75R0JED | RES SMD 75 OHM 5% 11W 1206 | datasheet.pdf | |
![]() | XCZU3CG-L1SFVA625I | Microprocessor Circuit, CMOS, PBGA625 IC | datasheet.pdf |