Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EFR-DI-CHDEC-LTE-SITE | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Software, Services | |
| Series | LogiCORE™ | |
| Type | License | |
| Applications | - | |
| Edition | - | |
| License Length | - | |
| License - User Details | - | |
| Operating System | - | |
| For Use With/Related Products | Xilinx FPGAs | |
| Media Delivery Type | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EFR-DI-CHDEC-LTE-SITE | |
| Related Links | EFR-DI-CHD, EFR-DI-CHDEC-LTE-SITE Datasheet, Xilinx Distributor | |
![]() | RBB60DHRN-S578 | CONN EDGE MCA DUAL .050 120 POS | datasheet.pdf | |
![]() | ASC06DRAI | CONN EDGECARD 12POS .100 R/A DIP | datasheet.pdf | |
![]() | STD2HNK60Z | MOSFET N-CH 600V 2A DPAK | datasheet.pdf | |
![]() | 300P11C | FUSE 300A 600V CERAM BOSY CSA | datasheet.pdf | |
![]() | 4606X-102-512LF | RES ARRAY 3 RES 5.1K OHM 6SIP | datasheet.pdf | |
![]() | H48-6A-300-300-2.0-0 | H48-6 SHEET 300X300X2MM | datasheet.pdf | |
![]() | 853-83-024-30-051101 | Connector Socket 24 Position 0.050" (1.27mm) Gold Surface Mount | datasheet.pdf | |
![]() | 14-8510-610C | CONN IC DIP SOCKET 14POS GOLD | datasheet.pdf | |
![]() | ATS-10D-164-C1-R0 | HEATSINK 45X45X35MM L-TAB | datasheet.pdf | |
![]() | MKP18443224000 | CAP FILM 22NF 20% 400VAC | datasheet.pdf | |
![]() | CTVS07RF-15-15B | CTV 15C 14#20 1#16 SKT J/N REC | datasheet.pdf | |
![]() | SOT23-6 | Thermal Resistance and Derating Information IC | datasheet.pdf |