Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EMM28DSUI | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Card Edge Connectors - Edgeboard Connectors | |
| Series | - | |
| Packaging | Tray | |
| Card Type | Non Specified - Dual Edge | |
| Gender | Female | |
| Number of Positions/Bay/Row | 28 | |
| Number of Positions | 56 | |
| Card Thickness | 0.062" (1.57mm) | |
| Number of Rows | 2 | |
| Pitch | 0.156" (3.96mm) | |
| Features | - | |
| Mounting Type | Through Hole | |
| Termination | Solder | |
| Contact Material | Phosphor Bronze | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Contact Type | Full Bellows | |
| Color | Blue | |
| Flange Feature | Top Mount Opening, Threaded Insert, 4-40 | |
| Operating Temperature | -65°C ~ 125°C | |
| Material - Insulation | Polybutylene Terephthalate (PBT) | |
| Read Out | Single | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EMM28DSUI | |
| Related Links | EMM2, EMM28DSUI Datasheet, Sullins Connector Solutions Distributor | |
![]() | ZGP323LSS2832C | IC Z8 GP MCU 32K OTP 28SOIC | datasheet.pdf | |
![]() | TLC1079CNSRG4 | IC OPAMP GP 110KHZ 14SO | datasheet.pdf | |
![]() | RNC55J1022BPR36 | RES 10.2K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RNC55J17R2BSBSL | RES 17.2 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RWR81SR750FSS73 | RES 0.75 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | CMF55133K00DHR6 | RES 133K OHM 1/2W 0.5% AXIAL | datasheet.pdf | |
![]() | 8N4DV85EC-0001CDI8 | IC OSC VCXO DUAL FREQ 6-CLCC | datasheet.pdf | |
![]() | 09457011538 | RJI 8AWG 28/7 CAT6 PUR IP20+I | datasheet.pdf | |
![]() | ATS-12F-137-C1-R0 | HEATSINK 25X25X10MM L-TAB | datasheet.pdf | |
![]() | DAMMG3H3PJ | COMBO 3W3 M PCB R/A G50 HP ZI | datasheet.pdf | |
| EFM8BB10F8G-A-QSOP24 | IC MCU 8KB 24QSOP | datasheet.pdf | ||
![]() | MKP385418160JKM2T0 | CAP FILM 0.18UF 5% 1600VDC AXIAL | datasheet.pdf |