Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EP3SL110F1152I4LN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Stratix® III L | |
| Number of LABs/CLBs | 4300 | |
| Number of Logic Elements/Cells | 107500 | |
| Total RAM Bits | 4992000 | |
| Number of I/O | 744 | |
| Number of Gates | - | |
| Voltage - Supply | 0.86 V ~ 1.15 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FBGA (35x35) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EP3SL110F1152I4LN | |
| Related Links | EP3SL110, EP3SL110F1152I4LN Datasheet, Alt Distributor | |
![]() | BC337BU | TRANS NPN 45V 0.8A TO-92 | datasheet.pdf | |
![]() | RBC30DRYS-S93 | CONN EDGECARD 60POS DIP .100 SLD | datasheet.pdf | |
![]() | GSM22DRAI | CONN EDGECARD 44POS R/A .156 SLD | datasheet.pdf | |
![]() | MMUN2215LT1G | TRANS PREBIAS NPN 0.4W SOT23-3 | datasheet.pdf | |
| RSMF2JT56R0 | RES METAL OX 2W 56 OHM 5% AXL | datasheet.pdf | ||
![]() | CF14JA2M20 | RES 2.2M OHM 1/4W 5% CARBON FILM | datasheet.pdf | |
![]() | DL2-J-S | DL2-J/S JUNCTION SHELL KIT | datasheet.pdf | |
![]() | 0634451923 | ANVIL | datasheet.pdf | |
![]() | MS3471W12-10SX | CONN RCPT 10POS INLINE SCKT | datasheet.pdf | |
![]() | C0603CH1H120J030BA | CAP CER 12PF 50V CH 0201 | datasheet.pdf | |
![]() | 2907884 | TERM BLOCK HOUSING | datasheet.pdf | |
![]() | MS24266R16T24S9-LC | 26500 24C 24#20 SKT PLUG | datasheet.pdf |