Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EP3SL70F780C4L | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 36 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Stratix® III L | |
| Number of LABs/CLBs | 2700 | |
| Number of Logic Elements/Cells | 67500 | |
| Total RAM Bits | 2699264 | |
| Number of I/O | 488 | |
| Number of Gates | - | |
| Voltage - Supply | 0.86 V ~ 1.15 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 780-BBGA, FCBGA | |
| Supplier Device Package | 780-FBGA (29x29) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EP3SL70F780C4L | |
| Related Links | EP3SL70, EP3SL70F780C4L Datasheet, Alt Distributor | |
![]() | TPIC8101DWR | IC KNOCK SENSOR INTERFACE 20SOIC | datasheet.pdf | |
![]() | 0239003.HXEP | FUSE GLASS 3A 250VAC 5X20MM | datasheet.pdf | |
![]() | PBC09DBBN | CONN HEADER .100 DUAL R/A 18POS | datasheet.pdf | |
![]() | MCU08050D6201BP500 | RES SMD 6.2K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | TSOP-I-DIP32-ADPT | ADAPTER TSOP-I TO 32-DIP | datasheet.pdf | |
| KAL50FB15R0 | RES CHAS MNT 15 OHM 1% 50W | datasheet.pdf | ||
![]() | 1879246-4 | RES SMD 2.49KOHM 0.1% 1/16W 0603 | datasheet.pdf | |
![]() | V24A15T400BG3 | CONVERTER MOD DC/DC 15V 400W | datasheet.pdf | |
![]() | 0513741072 | CONN FFC VERT 10POS 0.50MM SMD | datasheet.pdf | |
![]() | MS17347C22C23P | CONN RCPT 8POS JAM NUT PIN | datasheet.pdf | |
![]() | E91F351VND102MA80T | CAP ALUM 1000UF 20% 350V SNAP | datasheet.pdf | |
![]() | JT07RT-12-8P-014 | JT 8C 8#20 PIN RECEPT | datasheet.pdf |