Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EPC2012CENGR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | Assembling eGaN® FETs Die Attach Procedure Die Removal Procedure Using eGaN® FETs | |
| Featured Product | EPC Low Voltage eGaN® FETs | |
| Standard Package | 1,000 | |
| Category | Discrete Semiconductor Products | |
| Family | FETs - Single | |
| Series | eGaN® | |
| Packaging | Tape & Reel (TR) | |
| FET Type | GaNFET N-Channel, Gallium Nitride | |
| FET Feature | Standard | |
| Drain to Source Voltage (Vdss) | 200V | |
| Current - Continuous Drain (Id) @ 25°C | 5A (Ta) | |
| Rds On (Max) @ Id, Vgs | 100 mOhm @ 3A, 5V | |
| Vgs(th) (Max) @ Id | 2.5V @ 1mA | |
| Gate Charge (Qg) @ Vgs | 1nC @ 5V | |
| Input Capacitance (Ciss) @ Vds | 100pF @ 100V | |
| Power - Max | - | |
| Mounting Type | Surface Mount | |
| Package / Case | Die | |
| Supplier Device Package | Die Outline (4-Solder Bar) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EPC2012CENGR | |
| Related Links | EPC201, EPC2012CENGR Datasheet, EPC Distributor | |
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