Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EPC9002C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | Assembling eGaN® FETs Die Attach Procedure Die Removal Procedure Using eGaN® FETs | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation and Demonstration Boards and Kits | |
| Series | eGaN® | |
| Main Purpose | Power Management | |
| Embedded | - | |
| Utilized IC / Part | EPC2001C | |
| Primary Attributes | - | |
| Secondary Attributes | - | |
| Supplied Contents | Board | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EPC9002C | |
| Related Links | EPC9, EPC9002C Datasheet, EPC Distributor | |
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