Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-EPC9003C | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Mfg Application Notes | Assembling eGaN® FETs Die Attach Procedure Die Removal Procedure Using eGaN® FETs | |
Design Resources | EPC9003C Schematic EPC9003C BOM EPC9003C Gerber Files Development Tool Selector | |
Standard Package | 1 | |
Category | Programmers, Development Systems | |
Family | Evaluation and Demonstration Boards and Kits | |
Series | eGaN® | |
Main Purpose | Power Management, Half H-Bridge Driver (External FET) | |
Embedded | No | |
Utilized IC / Part | EPC2010C | |
Primary Attributes | - | |
Secondary Attributes | - | |
Supplied Contents | Board | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | EPC9003C | |
Related Links | EPC9, EPC9003C Datasheet, EPC Distributor |
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