Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EPF10K130EQI240-2N | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | FLEX-10KE® | |
| Number of LABs/CLBs | 832 | |
| Number of Logic Elements/Cells | 6656 | |
| Total RAM Bits | 65536 | |
| Number of I/O | 186 | |
| Number of Gates | 342000 | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 240-BFQFP | |
| Supplier Device Package | 240-PQFP (32x32) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EPF10K130EQI240-2N | |
| Related Links | EPF10K130, EPF10K130EQI240-2N Datasheet, Alt Distributor | |
![]() | FH12-50S-0.5SH | CONN FFC BOTTOM 50POS 0.50MM R/A | datasheet.pdf | |
![]() | ECM15DCTI | CONN EDGECARD 30POS DIP .156 SLD | datasheet.pdf | |
| LGY1J392MELA40 | CAP ALUM 3900UF 20% 63V SNAP | datasheet.pdf | ||
![]() | 432115-17-0 | Connector Barrier Block Strip 17 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | RNC55H56R2BSRE6 | RES 56.2 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | C187EVK01/NOPB | KIT EVAL FOR DS90C187 | datasheet.pdf | |
![]() | MI-25Z-IW-F3 | CONVERT DC/DC 155VIN 2VOUT 40W | datasheet.pdf | |
![]() | M80-8874405 | Connector Receptacle 4 Position 0.079" (2.00mm) Gold Through Hole | datasheet.pdf | |
![]() | 550-10-292M20-001152 | BGA SOLDER TAIL | datasheet.pdf | |
![]() | ATS-21G-91-C1-R0 | HEATSINK 40X40X10MM R-TAB | datasheet.pdf | |
![]() | D38999/20JJ11SC | CTV 11C 2#20 9#10 SKT RECP | datasheet.pdf | |
![]() | TVS06RK-9-98SD | TV 3C 3#20 SKT PLUG | datasheet.pdf |