Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EPF10K50SBC356-2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | FLEX-10KS® | |
| Number of LABs/CLBs | 360 | |
| Number of Logic Elements/Cells | 2880 | |
| Total RAM Bits | 40960 | |
| Number of I/O | 220 | |
| Number of Gates | 199000 | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 356-LBGA | |
| Supplier Device Package | 356-BGA (35x35) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EPF10K50SBC356-2 | |
| Related Links | EPF10K50, EPF10K50SBC356-2 Datasheet, Alt Distributor | |
![]() | H2BXG-10106-N8 | JUMPER-H1501TR/A3048N/X 6" | datasheet.pdf | |
![]() | MPXM2053GST1 | SENS PRESSURE 7.25 PSI MAX MPAK | datasheet.pdf | |
![]() | STD2NM60T4 | MOSFET N-CH 600V 2A DPAK | datasheet.pdf | |
![]() | RR0816Q-16R9-D-23R | RES SMD 16.9 OHM 0.5% 1/16W 0816 | datasheet.pdf | |
![]() | RCB15DHLD | CONN EDGECARD 30POS DIP .050 SLD | datasheet.pdf | |
![]() | 61082-123122 | CONN RECEPT 120POS .8MM DUAL SMD | datasheet.pdf | |
![]() | MS3476W22-55SZ | CONN PLUG 55POS STRAIGHT W/SKT | datasheet.pdf | |
![]() | RER60F2R15RCSL | RES CHAS MNT 2.15 OHM 1% 5W | datasheet.pdf | |
![]() | RER65F7320RC02 | RES CHAS MNT 732 OHM 1% 10W | datasheet.pdf | |
| 591AD-DDG | OSC PROG 3.3V LVPECL HIGH 7PPM | datasheet.pdf | ||
![]() | TX30AB45-2412-CS2514 | CONN BACKSHELL ADPT SZ 25G OLIVE | datasheet.pdf | |
![]() | AIT6-20-17PC | ER 6C 1#16 5#12 PIN PLUG | datasheet.pdf |