Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-F1772SX243931KIMT0 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | AC Film Caps Connect w/Mains Appl Note Soldering Guidelines Appl Note | |
| Standard Package | 200 | |
| Category | Capacitors | |
| Family | Film Capacitors | |
| Series | F1772S X2 | |
| Packaging | * | |
| Capacitance | 0.39µF | |
| Tolerance | ±10% | |
| Voltage Rating - AC | 310V | |
| Voltage Rating - DC | 630V | |
| Dielectric Material | Polyester, Metallized | |
| ESR (Equivalent Series Resistance) | - | |
| Operating Temperature | -55°C ~ 110°C | |
| Mounting Type | * | |
| Package / Case | * | |
| Size / Dimension | * | |
| Height - Seated (Max) | * | |
| Termination | * | |
| Lead Spacing | * | |
| Applications | EMI, RFI Suppression | |
| Features | X2 Safety Rated | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | F1772SX243931KIMT0 | |
| Related Links | F1772SX24, F1772SX243931KIMT0 Datasheet, Vishay/BCcomponents Distributor | |
![]() | SN74ABT162601DLR | IC UNIV BUS TXRX 18BIT 56SSOP | datasheet.pdf | |
![]() | GRM55ER71H475MA01L | CAP CER 4.7UF 50V X7R 2220 | datasheet.pdf | |
![]() | 20J5K6E | RES 5.6K OHM 10W 5% AXIAL | datasheet.pdf | |
![]() | MAX8864REUK+T | IC REG LDO 2.8V/ADJ SOT23-5 | datasheet.pdf | |
![]() | OPB860L11 | SENS OPTO SLOT 3.18MM TRANS THRU | datasheet.pdf | |
![]() | OSTKG070080 | TERM BLOCK HDR 7POS VERT 5MM | datasheet.pdf | |
![]() | RNC55H9423BSB14 | RES 942K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RWR89N1001FSBSL | RES 1K OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | 0625002155 | CYLINDER SENSOR | datasheet.pdf | |
![]() | 416F38022AAT | CRYSTAL 38.000 MHZ 10PF SMT | datasheet.pdf | |
![]() | B-801-46 | SOLDERSLEEVE | datasheet.pdf | |
![]() | LDB181G8405C-110 | Chip Multilayer Hybrid Baluns | datasheet.pdf |