Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-FDG6306P | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | High Voltage Switches for Power Processing | |
| PCN Design/Specification | Mold Compound 12/Dec/2007 Mold Compound 07/May/2008 | |
| PCN Packaging | Binary Year Code Marking 15/Jan/2014 | |
| Standard Package | 3,000 | |
| Category | Discrete Semiconductor Products | |
| Family | FETs - Arrays | |
| Series | PowerTrench® | |
| Packaging | Tape & Reel (TR) | |
| FET Type | 2 P-Channel (Dual) | |
| FET Feature | Logic Level Gate | |
| Drain to Source Voltage (Vdss) | 20V | |
| Current - Continuous Drain (Id) @ 25°C | 600mA | |
| Rds On (Max) @ Id, Vgs | 420 mOhm @ 600mA, 4.5V | |
| Vgs(th) (Max) @ Id | 1.5V @ 250µA | |
| Gate Charge (Qg) @ Vgs | 2nC @ 4.5V | |
| Input Capacitance (Ciss) @ Vds | 114pF @ 10V | |
| Power - Max | 300mW | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-TSSOP, SC-88, SOT-363 | |
| Supplier Device Package | SC-70-6 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | FDG6306P | |
| Related Links | FDG6, FDG6306P Datasheet, Fairchild Semiconductor Distributor | |
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