Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-FFAM062*2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 10 | |
| Category | RF/IF and RFID | |
| Family | RFI and EMI - Shielding and Absorbing Materials | |
| Series | FFAM | |
| Shape | Sheet | |
| Thickness - Overall | 0.024" (0.6mm) | |
| Width | 7.874" (200.00mm) | |
| Length | 7.874" (200.00mm) | |
| Adhesive | - | |
| Temperature Range | -67 ~ 257°F (-55 ~ 125°C) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | FFAM062*2 | |
| Related Links | FFAM, FFAM062*2 Datasheet, API Delevan Distributor | |
| AC8-DK | CORD POWER U.K. W/C6 RECPT | datasheet.pdf | ||
![]() | MBRB10H100-E3/45 | DIODE SCHOTTKY 100V 10A TO263AB | datasheet.pdf | |
![]() | VE-JNX-CX-F4 | CONVERTER MOD DC/DC 5.2V 75W | datasheet.pdf | |
![]() | VE-B4R-CW | CONVERTER MOD DC/DC 7.5V 100W | datasheet.pdf | |
![]() | 114-87-318-41-134191 | CONN IC DIP SOCKET 18POS GOLD | datasheet.pdf | |
![]() | 051670101300 | PMI BASE 1 INCAND S-6 CNDLBR QC | datasheet.pdf | |
![]() | ATS-12F-145-C1-R0 | HEATSINK 30X30X30MM L-TAB | datasheet.pdf | |
![]() | ATS-10C-187-C1-R0 | HEATSINK 45X45X10MM R-TAB | datasheet.pdf | |
![]() | DX30-20SGP | CONN 20POS GUIDE PLATE | datasheet.pdf | |
![]() | CCM01-2624 LFT T25 | LOW PROFILE SMART CARD CONN | datasheet.pdf | |
![]() | MKP386M433200JT1 | MKP 0.33UF 5% 2000VDC DRAWING T1 | datasheet.pdf | |
![]() | 10-597109-33D | ER CON 16 20-22 SKT CRIMP GOLD | datasheet.pdf |