Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-FGG.3B.316.YL | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | 3B | |
| Packaging | Bulk | |
| Connector Type | Insert for Male Contacts | |
| Number of Positions | 16 | |
| Shell Size - Insert | 316 | |
| Shell Size, MIL | - | |
| Contact Type | Crimp and Solder Cup | |
| Contact Size | 0.9mm | |
| Mounting Type | - | |
| Fastening Type | - | |
| Orientation | G | |
| Shell Material, Finish | - | |
| Ingress Protection | IP50 - Dust Protected | |
| Features | Insert Only, Requires Shell, Shielded | |
| Note | Contacts Not Provided | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | FGG.3B.316.YL | |
| Related Links | FGG.3B, FGG.3B.316.YL Datasheet, LEMO Distributor | |
![]() | EXB50-24S3V3-R | CONV DC/DC OPEN FRM 3.3V OUT 50W | datasheet.pdf | |
![]() | MT16VDDT6464AG-26AG4 | MODULE SDRAM DDR 512MB 184DIMM | datasheet.pdf | |
![]() | LQM21FN220N00L | FIXED IND 22UH 13MA 350 MOHM SMD | datasheet.pdf | |
![]() | MAX306CPI+ | IC MULTIPLEXER 16X1 28DIP | datasheet.pdf | |
![]() | RSM15DRXS | CONN EDGECARD 30POS DIP .156 SLD | datasheet.pdf | |
![]() | XC3S250E-4CPG132I | IC FPGA 92 I/O 132CSBGA | datasheet.pdf | |
![]() | DAC5681IRGCR | IC DAC 16BIT PAR/SER 64VQFN | datasheet.pdf | |
![]() | FK22L | OVEN FOOD PROBE | datasheet.pdf | |
![]() | MX3SWT-A1-0000-0009A9 | LED XLAMP WARM WHITE 2850K 2SMD | datasheet.pdf | |
![]() | 09252186850 | DIN-SIGNAL 3C018FP-4,5C1-2 | datasheet.pdf | |
![]() | 203-22-1-42-252-5-1-5 | CIR BRKR 2.5A 32VDC ROCKER | datasheet.pdf | |
![]() | AD9708-EB | 8-Bit, 100 MSPS TxDAC D/A Converter IC | datasheet.pdf |