Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-FX8C-60P-SV2(93) | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 500 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | FunctionMax™ FX8C | |
| Packaging | Tape & Reel (TR) | |
| Connector Type | Header, Outer Shroud Contacts | |
| Number of Positions | 60 | |
| Pitch | 0.023" (0.60mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide | |
| Contact Finish | Gold | |
| Contact Finish Thickness | - | |
| Mated Stacking Heights | 7mm, 12mm | |
| Height Above Board | 0.254" (6.45mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | FX8C-60P-SV2(93) | |
| Related Links | FX8C-60P, FX8C-60P-SV2(93) Datasheet, Hirose Electric Co Ltd Distributor | |
![]() | ERJ-3EKF3243V | RES SMD 324K OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | RG2012N-3091-D-T5 | RES SMD 3.09K OHM 0.5% 1/8W 0805 | datasheet.pdf | |
![]() | LM2623MMX/NOPB | IC REG BOOST ADJ 2.2A 8VSSOP | datasheet.pdf | |
![]() | VI-JWZ-EY-F3 | CONVERTER MOD DC/DC 2V 20W | datasheet.pdf | |
![]() | TB-60.000MBD-T | OSC MEMS 60.000MHZ CMOS SMD | datasheet.pdf | |
![]() | RN55C1073CRSL | RES 107K OHM 1/8W .25% AXIAL | datasheet.pdf | |
![]() | RN60C8062FB14 | RES 80.6K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | 1200040000 | BOX S STEEL 12.05"L X 12.05"W | datasheet.pdf | |
![]() | 350-80-109-00-106191 | CONN HDR 9POS 0.100 SMD TIN | datasheet.pdf | |
![]() | ATS-06G-25-C3-R0 | HEATSINK 60X60X25MM XCUT T412 | datasheet.pdf | |
![]() | WSL40261L000FEK | RES SMD 0.001 OHM 1% 3W 4026 | datasheet.pdf | |
![]() | CB3LV-3C-83M3300 | OSC XO 83.33MHZ HCMOS TTL SMD | datasheet.pdf |