Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-GCB75DHNN | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 10 | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Series | - | |
Packaging | Tube | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | 75 | |
Number of Positions | 150 | |
Card Thickness | 0.062" (1.57mm) | |
Number of Rows | 2 | |
Pitch | 0.050" (1.27mm) | |
Features | - | |
Mounting Type | Through Hole | |
Termination | Solder | |
Contact Material | Phosphor Bronze | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Contact Type | Hairpin Bellows | |
Color | Black | |
Flange Feature | - | |
Operating Temperature | -65°C ~ 125°C | |
Material - Insulation | Polyamide (PA9T) | |
Read Out | Dual | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | GCB75DHNN | |
Related Links | GCB7, GCB75DHNN Datasheet, Sullins Connector Solutions Distributor |
![]() | 1-331677-4 | CONN SOCKET RCPT .030-.033 30AU | datasheet.pdf | |
![]() | CS3FR001E | RES 0.001 OHM 3W 1% 4SIP | datasheet.pdf | |
![]() | LT6010CS8 | IC OPAMP GP 350KHZ RRO 8SO | datasheet.pdf | |
![]() | 95002-2883 | CONN MOD JACK 8P8C VERT UNSHLD | datasheet.pdf | |
![]() | MRJ0700DD-A | C/A MRJ21/MRJ21 GBE STRT CMR 70M | datasheet.pdf | |
![]() | VI-211-EX-F1 | CONVERTER MOD DC/DC 12V 75W | datasheet.pdf | |
![]() | 25NXA33MEFC5X11 | CAP ALUM 33UF 20% 25V RADIAL | datasheet.pdf | |
![]() | Y1685V0005TT0W | RES NETWORK 2 RES MULT OHM 1505 | datasheet.pdf | |
![]() | 76745-1BT-36LF | HEADER BERGSTIK | datasheet.pdf | |
![]() | F3SJ-A0785P20 | F3SJ-A0785P20 | datasheet.pdf | |
![]() | 1757831-6 | AMPLIMITE PLUG ASY POSTD 109 1 | datasheet.pdf | |
![]() | EP7311-ER-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |