Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-GSM08DTMD-S664 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Card Edge Connectors - Edgeboard Connectors | |
| Series | - | |
| Packaging | Tray | |
| Card Type | Non Specified - Dual Edge | |
| Gender | Female | |
| Number of Positions/Bay/Row | 8 | |
| Number of Positions | 16 | |
| Card Thickness | 0.125" (3.18mm) | |
| Number of Rows | 2 | |
| Pitch | 0.156" (3.96mm) | |
| Features | - | |
| Mounting Type | Through Hole, Right Angle | |
| Termination | Solder | |
| Contact Material | Phosphor Bronze | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 10µin (0.25µm) | |
| Contact Type | Loop Bellows | |
| Color | Black | |
| Flange Feature | Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia | |
| Operating Temperature | -65°C ~ 125°C | |
| Material - Insulation | Polyamide (PA9T) | |
| Read Out | Dual | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | GSM08DTMD-S664 | |
| Related Links | GSM08DT, GSM08DTMD-S664 Datasheet, Sullins Connector Solutions Distributor | |
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