Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-H-33-BIN | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1,000 | |
Category | Connectors, Interconnects | |
Family | Terminals - Wire Splice Connectors | |
Series | Highland™ | |
Packaging | Bulk | |
Terminal Type | Wire Nut | |
Number of Wire Entries | Varies by Wire Size | |
Termination | Twist On | |
Wire Gauge | 14-22 AWG | |
Insulation | Fully Insulated | |
Features | Copper Wire Only | |
Color | Yellow | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | H-33-BIN | |
Related Links | H-33, H-33-BIN Datasheet, 3M Distributor |
![]() | 8017010000 | GDT 230V 10% DIN RAIL | datasheet.pdf | |
![]() | AD669BN | IC DAC 16BIT MONO VREF 28-DIP | datasheet.pdf | |
![]() | 74HCT4538N,112 | IC DUAL RETRIG MULTIVIB 16DIP | datasheet.pdf | |
![]() | HMC20DRTN | CONN EDGECARD 40POS DIP .100 SLD | datasheet.pdf | |
![]() | GEC22DRYH-S734 | CONN EDGECARD 44POS DIP .100 SLD | datasheet.pdf | |
![]() | EP4CE55F29C8 | IC FPGA 374 I/O 780FBGA | datasheet.pdf | |
![]() | RNC55H18R0BRB14 | RES 18 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RNC50H8870DSRSL | RES 887 OHM 1/10W .5% AXIAL | datasheet.pdf | |
![]() | 558-00407 | 4" RED REF VINYL 100'/RL | datasheet.pdf | |
![]() | ATS-13H-141-C3-R0 | HEATSINK 30X30X10MM L-TAB T412 | datasheet.pdf | |
![]() | MMBZ4714-E3-18 | DIODE ZENER 33V 350MW SOT23-3 | datasheet.pdf | |
![]() | AD1991 | Class D/1-Bit Audio Power Output Stage IC | datasheet.pdf |