Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-H3ABG-10104-S8 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | DF11 Series | |
| Standard Package | 10 | |
| Category | Cable Assemblies | |
| Family | Jumper Wires, Pre-Crimped | |
| Series | DF11 | |
| Contact End | Pin to Socket | |
| Length | 4.0" (101.6mm) | |
| Wire Gauge | 28 AWG | |
| Contact Finish | Gold | |
| Color | Gray | |
| Contact Finish Thickness | - | |
| Number of Rows | 1 | |
| Number of Conductors | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | H3ABG-10104-S8 | |
| Related Links | H3ABG-1, H3ABG-10104-S8 Datasheet, Hirose Electric Co Ltd Distributor | |
![]() | 5747959-1 | CONN D-SUB RECEPT 50POS W/O CONT | datasheet.pdf | |
![]() | GCA06DTKN | CONN EDGECARD 12POS DIP .125 SLD | datasheet.pdf | |
![]() | MAX4071AUA+T | IC OPAMP CURR SENSE 100KHZ 8UMAX | datasheet.pdf | |
![]() | ESR10EZPF7501 | RES SMD 7.5K OHM 1% 0.4W 0805 | datasheet.pdf | |
![]() | AX2000-FGG1152I | IC FPGA 684 I/O 1152FBGA | datasheet.pdf | |
![]() | P61-200-S-A-I18-4.5V-C | SENSOR 200PSIS 1/4 NPT W/TEMP | datasheet.pdf | |
![]() | 8N4SV76LC-0130CDI8 | IC OSC VCXO 174.8MHZ 6-CLCC | datasheet.pdf | |
![]() | ATS-01H-47-C3-R0 | HEATSINK 25X25X30MM L-TAB T412 | datasheet.pdf | |
![]() | PIC12F1612-E/MF | IC MCU 8BIT 3.5KB FLASH 8DFN | datasheet.pdf | |
![]() | CB3-6C-30M0000 | OSC XO 30.000MHZ HCMOS TTL SMD | datasheet.pdf | |
![]() | CN0967C24S30S7-000 | 26500 30C 30#16 S RECP SS LC | datasheet.pdf | |
![]() | 97-3107B20-29SW | AB 17C 17#16 SKT PLUG | datasheet.pdf |