FFF H609008000J0G

H609008000J0G picture photo
Mfg. Part Number
H609008000J0G
Manufacturer
Product Category
Terminal Blocks - Wire to Board
Brief Description
500 TB SPR CLA R/HOLE
Datasheet Download
H609008000J0G.pdf
Availability of H609008000J0G

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 1.61733
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of H609008000J0G, we specialize in FFF all series electronic components. H609008000J0G can be shipped within 24 hours after order. If you have any demands for H609008000J0G, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
H609008000J0G Order Process
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Specifications of H609008000J0G
Internal Part NumberEIS-H609008000J0G
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Standard Package2,090
Category Connectors, Interconnects
FamilyTerminal Blocks - Wire to Board
SeriesH6
PackagingBulk
Number of Levels1
Positions Per Level9
Pitch0.197" (5.00mm)
Mating OrientationHorizontal with Board
Current11A
Voltage300V
Wire Gauge12-20 AWG
Mounting TypeThrough Hole
Wire TerminationScrewless - Push Button Clamp
Features-
ColorGray
Operating Temperature-40°C ~ 115°C
Housing MaterialThermoplastic
Contact Material - PlatingBrass - Tin Plated
Clamp Material - PlatingSteel, Stainless
Screw Material - Plating-
Torque - Screw-
Screw Thread-
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)H609008000J0G
Related LinksH60900, H609008000J0G Datasheet, FFF Distributor
H609008000J0G Details Description
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