Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-HBM08DSEI | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Series | - | |
Packaging | Tray | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | 8 | |
Number of Positions | 16 | |
Card Thickness | 0.062" (1.57mm) | |
Number of Rows | 2 | |
Pitch | 0.156" (3.96mm) | |
Features | - | |
Mounting Type | Panel Mount | |
Termination | Solder Eyelet(s) | |
Contact Material | Beryllium Copper | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Contact Type | Full Bellows | |
Color | Blue | |
Flange Feature | Top Mount Opening, Threaded Insert, 4-40 | |
Operating Temperature | -65°C ~ 125°C | |
Material - Insulation | Polybutylene Terephthalate (PBT) | |
Read Out | Dual | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | HBM08DSEI | |
Related Links | HBM0, HBM08DSEI Datasheet, Sullins Connector Solutions Distributor |
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