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Renesas Electronics America HD6417709F74BIV

HD6417709F74BIV picture photo
Mfg. Part Number
HD6417709F74BIV
Manufacturer
Product Category
Embedded - Microcontrollers
Brief Description
IC MCU 32BIT ROMLESS 208LQFP
Datasheet Download
HD6417709F74BIV.pdf
Availability of HD6417709F74BIV

Available Quantity

5020 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

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EIS Components is the stocking Distributor of HD6417709F74BIV, we specialize in Renesas Electronics America all series electronic components. HD6417709F74BIV can be shipped within 24 hours after order. If you have any demands for HD6417709F74BIV, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
HD6417709F74BIV Order Process
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Specifications of HD6417709F74BIV
Internal Part NumberEIS-HD6417709F74BIV
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)Obsolete / Discontinued
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
Standard Package1
Category Integrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
SeriesSuperH® SH7700
PackagingTray
Core ProcessorSH-3
Core Size32-Bit
Speed74MHz
Connectivity-
Peripherals-
Number of I/O96
Program Memory Size-
Program Memory TypeROMless
EEPROM Size-
RAM Size16K x 8
Voltage - Supply (Vcc/Vdd)-
Data ConvertersA/D 8x10b; D/A 2x8b
Oscillator TypeInternal
Operating Temperature-20°C ~ 75°C
Package / Case208-LQFP
Supplier Device Package*
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)HD6417709F74BIV
Related LinksHD64177, HD6417709F74BIV Datasheet, Renesas Electronics America Distributor
HD6417709F74BIV Details Description
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